Hyper ThreAding和SMT的区别在于()。A 多组寄存器B 并行执行多个线程C 共享执行单元D 共享控制逻辑

题目
Hyper ThreAding和SMT的区别在于()。

A 多组寄存器

B 并行执行多个线程

C 共享执行单元

D 共享控制逻辑

相似考题

1.Your network contains a database server named Server1 that runs Windows Server 2003 Service Pack 2 (SP2).Server1 has the following hardware configurations:·A single processor that supports hyper-threading·Dual processor motherboard·Two hard disks·2 GB of RAMThe first disk contains all the files for the operating system and applications. The second disk is empty.Hyper-threading is disabled in the BIOS.Users report a slow response when they query the database on Server1.You monitor Server1 for one day and receive the performance statistics shown in the following table.You need to improve database performance.What should you do? （）A. Upgrade the RAM to 4 gb.B. Install a second processor.C. Enable hyper-threading in the bios.D. Move the database to the second disk.

2.WhichofthefollowingisrequiredtouseSimultaneousMulti－Threading(SMT)?()A.smtctlcommandB.AdualcorechipC.AIX5.3operatingsystemandPOWER5hardwareD.AdvancedVirtualizationwhichisaseparatelypurchasedproduct

3.“威”和“味”的读音区别在于音色，“评”和“贫”的读音区别在于音高。A对B错

4.Companycomhaspurchasedap5590with16CPUs.TorunSimultaneousMulti－Threading(SMT)witha4－wayvirtualprocessorpartitionwith2.0processingunitsofentitlement,howmanylogicalCPUswillbeallocated?()A.8-waylogicalCPUpartition,whereeachlogicalCPUhasthepowerof25%ofalogicalprocessorB.4-waylogicalCPUpartition,whereeachlogicalCPUhasthepowerof50%ofaphysicalprocessorC.8-waylogicalCPUpartition,whereeachlogicalCPUhasthepowerof25%ofaphysicalprocessorD.16-waylogicalCPUpartition,whereeachlogicalCPUhasthepowerof25%ofaphysicalprocessor

参考答案和解析
参考答案B
更多“Hyper ThreAding和SMT的区别在于()。 ”相关问题

  • 第1题：

    “战争”和“战役”这组同义词的区别在于（），“爱好”和“嗜好”这组同义词的区别在于（）。
    范围大小；语义轻重
    略

  • 第2题：

    smT、smt代表2个不同的变量


    D

  • 第3题：

    THT封装与SMT封装的最大区别在于引脚焊盘属性不同，元器件SMT封装一般焊盘属性中Layer的选择是（）。

    A．Multi-Layer

    B．Top layer

    C．Bottom layer

    D．Top Overlay


    Multi-Layer

  • 第4题：

    THT和SMT都是通孔安装技术。


    错误

  • 第5题：

    THT封装与SMT封装的最大区别在于引脚焊盘属性不同，元器件THT封装一般焊盘属性中Layer的选择是（）。

    A．Top layer

    B．Bottom layer

    C．Multi-Layer

    D．Top Overlay


    Multi-Layer

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